SMT Dual-Track Flipping Machine with 90°/180°/360° Multi-angle Rotation and 220V Power Supply for PCB Synchronous Conveying

SMT Dual-Rail Flipping Machine

I. Equipment Parameters
Model: OK-FBJ-250
Dimensions: 500*1440*1300mm
Conveying Height: 900±30mm (Compatible with standard SMT production lines)
Applicable PCB Specifications: Width 50-250mm, Maximum Length 350mm
Power Supply: 220V / 0.35KW (Energy-saving and environmentally friendly)
Conveying Direction: Freely switchable left and right, adaptable to different production line layouts
Working Air Pressure: 4-6 bar (Suitable with standard workshop air sources)
Net Weight: 230kg (Stable and stable operation)
Flipping Function: Supports 90°/180°/360° multi-angle flipping
Conveying Structure: Dual-rail synchronous conveying, smooth operation without deviation

II. Equipment Features:

 Enclosed sheet metal and aluminum alloy body for enhanced protection, durability, and resistance to deformation, ensuring safer workshop operation. Stepper motor paired with ball screw lifting transmission provides precise, quiet lifting and stable operation even after prolonged use. PLC intelligent control system with touchscreen operation, featuring self-diagnostic prompts for easy operation, even for beginners. Hand-cranked ball screw track adjustment allows for precise and smooth width adjustment, compatible with various PCB materials. Dual audible and visual alarms provide timely fault alerts, minimizing production line downtime. Standard SMEMA universal communication interface allows for seamless integration with upstream and downstream SMT production lines.

 III. Application Scenarios

 **Post-Installation Flipping Process:** The circuit board automatically flips after insertion, enabling separate surface mount operations for both sides, meeting the needs of double-sided component soldering production.
 **Finished Product Inspection Flipping:** After surface mount soldering, the board is flipped, facilitating comprehensive quality inspection of components and circuitry on the back of the circuit board by inspection equipment, controlling product yield.
 **Circuit Board Rework:** Quick flipping during soldering defect repairs allows repair personnel to easily disassemble and reassemble components on the back, significantly improving rework efficiency.
 **Adhesive Dispensing and Curing Flipping:** Automatic flipping after adhesive dispensing on the back ensures the adhesive cures naturally without dripping, preserving dispensing accuracy and subsequent processes.