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Quality OK‑SP460‑C Automatic Stencil Cleaner, Wet & Dry Dual‑Use For SMT PCB 510×340mm factory
Quality OK‑SP460‑C Automatic Stencil Cleaner, Wet & Dry Dual‑Use For SMT PCB 510×340mm factory
Quality OK‑SP460‑C Automatic Stencil Cleaner, Wet & Dry Dual‑Use For SMT PCB 510×340mm factory
Quality OK‑SP460‑C Automatic Stencil Cleaner, Wet & Dry Dual‑Use For SMT PCB 510×340mm factory
Quality OK‑SP460‑C Automatic Stencil Cleaner, Wet & Dry Dual‑Use For SMT PCB 510×340mm factory
Quality OK‑SP460‑C Automatic Stencil Cleaner, Wet & Dry Dual‑Use For SMT PCB 510×340mm factory
Quality OK‑SP460‑C Automatic Stencil Cleaner, Wet & Dry Dual‑Use For SMT PCB 510×340mm factory

OK‑SP460‑C Automatic Stencil Cleaner, Wet & Dry Dual‑Use For SMT PCB 510×340mm

Basic Properties
Place of Origin: Guangdong, China
Brand Name: Okai Intelligent Technology Co., Ltd.
Certification: ISO 9001
Model Number: OK-GBQXJ
Trading Properties
Minimum Order Quantity: 1 Set
Price: open to negotiation
Payment Terms: T/T
Supply Ability: 1000 Sets per Month
Tags

SMT Solder Paste Printer

smt printing machine

solder paste printing machine
Product Summary
OK‑SP460‑C automatic stencil cleaner adopts wet & dry dual‑use cleaning mode, compatible with 510×340mm stencil, widely used for SMT PCB production line. Stable performance, multiple sizes and custom service available.

Product Details

Equipment Name: OK-SP460-C Fully Automatic Stencil Cleaning Machine
Suitable Production Lines: 24-hour High-capacity SMT Production Lines
Compatible Solder Paste: Type 4/5 Fine-pitch Solder Paste
Application Industries: Automotive Electronics, Mobile Phone Assembly
Packaging: Export Wooden Crate With Independent Compartment For Consumables
Included Consumables: Initial Consumable Rolls Included
Delivery Time: 7-15 Working Days
Product Description

OK-SP460-C Auto Stencil Cleaning Fully Automatic Solder Paste Printer

The OK-SP460-C is equipped with an integrated three-mode automatic stencil cleaning system (dry, wet, and vacuum) that maintains stencil aperture integrity through extended production runs. By eliminating manual stencil wiping, it reduces downtime, improves print consistency, and extends stencil service life.

Key Features

  • Three-Mode Cleaning: Dry wipe removes residual paste, wet cleaning dissolves hardened deposits, and vacuum extraction removes debris automatically
  • Programmable Frequency: Set cleaning intervals from every 1 to 99 prints based on paste type and production requirements
  • 400mm Paper Roll: Large-capacity cleaning paper roll supports full-shift unmanned operation
  • Bottom-Side Cleaning: Dedicated underside cleaning mechanism prevents paste buildup that causes bridging defects
  • Solvent Management: Precision solvent dispensing with low-level sensor alarm prevents dry-wipe cleaning damage to stencils
  • CCD Vision Alignment: Accurate registration maintained throughout cleaning cycles with automatic recalibration

Technical Specifications

Parameter Value
Cleaning Modes Dry, Wet, Vacuum
Cleaning Paper Width 400mm roll
Cleaning Frequency Programmable, 1-99 prints
Max PCB Size 510*340mm
Min PCB Size 50*50mm
Repeat Accuracy ±15μm
Printing Accuracy ±30μm
Cycle Time under 10s


Applications

Suitable for 24/7 high‑volume SMT production lines with Type 4/5 fine‑pitch solder paste, to avoid printing defects caused by stencil clogging. Widely applied in automotive electronics and smartphone assembly scenarios requiring high production yield.

Packaging and Shipping

Packed in standard export wooden crate, with separate space for cleaning consumables including initial roll. Delivery within 7‑15 working days.

Mr. Cai

general manager

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