Single Rail PCB Flipping Machine with 180° / 360° Flip and PLC Touch Screen Control for SMT Production Lines

Single-rail PCB flipping machine, SMT production line PCB flipping equipment

一,Equipment parameters
Model  :  OK-FBJ-460

Overall Dimension  :  600*950*1500mm

Conveying Height  :900±30mm

Applicable PCB Size  :  Width 50-460mm, Max Length 450mm

Power Parameter  :  220V / 0.35KW

Convey Direction  : Left-right / Right-left switchable

Working Air Pressure  : 4-6bar

Machine Weight  :  160kg

Rail Structure  :  Single rail

Flip Mode  :  180°, 360° rotation

II. Equipment Features

1. One-piece enclosed aluminum alloy body, isolating potential operational hazards and providing robust safety protection.

2. Stepper motor paired with ball screw drives the material frame lifting, ensuring smooth and even material feeding.

3. PLC integrated control system with touchscreen, featuring fault identification and alerts for simple and intuitive operation.

4. Supports 90° and 180° multi-angle flipping, adapting to different process material flipping requirements.

5. Hand-cranked screw width adjustment mechanism for stable adjustment and compatibility with various circuit board specifications.

6. Dual alarm alerts: audible and visual prompts combined with screen pop-ups for rapid identification of equipment malfunctions.

7. Standard SMEMA universal communication port for seamless integration with entire automated SMT production lines.

III. Application Scenarios

1. Post-Installation Flipping: After single-sided component insertion, the circuit board is flipped over for surface mount technology (SMT) on the other side, enabling double-sided component assembly.

2. Inspection Process Board Flipping: After soldering and SMT, the board is flipped over, allowing inspection equipment to access the back of the circuit board for component performance testing.

3. Defective Board Rework Flipping: After flipping a board with soldering defects, workers can easily disassemble and install components on the back, improving rework efficiency.

4. Backside Adhesive Dispensing Process Flipping: After adhesive dispensing, the board is flipped over, allowing the adhesive to cure naturally and prevent dripping, ensuring processing quality and facilitating subsequent processes.