SMT buffer PCB board buffer

SMT Single-Rail NGOK Buffer Machine

Equipment Parameters

Model: OK-HCJ-460
Dimensions: 600*1080*1600mm
Conveyor Height: 900±30mm (Suitable for standard SMT production lines)
Compatible PCB Specifications: PCB width 50-460mm, maximum length 450mm
Power Supply: 220V
Power Consumption: 0.35KW, energy-saving and low-consumption
Conveyor Direction: Left-to-right/Right-to-left bidirectional selection, adaptable to any production line layout
Buffer Capacity: Buffers 20 PCBs per batch
Operating Air Pressure: 4-6 bar
Net Weight: 200kg
Rail Structure: Customized single-rail design, saving production line space

Core Equipment Features

Enclosed sheet metal + high-strength aluminum alloy integrated structure, high protection level, stable and durable operation, dustproof and impact-resistant.

Integrates NG/OK separation, material buffering, and straight-through operation modes into one machine, offering multiple uses and improving production line flexibility.

Original PLC intelligent control system, stable operation without board jamming, suitable for long-term uninterrupted mass production.

Supports both FIFO and LIFO (Last-In, First-Out) material output logic to meet different production scheduling needs.

High-definition touchscreen operation interface with built-in automatic fault diagnosis function, simple human-machine interaction, reducing manual maintenance costs.

Buffer lifting step distance can be freely set according to PCB board thickness, adaptable to various board thicknesses.

Hand-cranked screw-type width adjustment mechanism, precise adjustment, stable alignment without deviation.

Multiple audible and visual alarms + screen pop-up prompts, real-time fault warnings, reducing downtime losses.

Standard SMEMA communication interface, seamlessly connects to upstream and downstream equipment such as AOI, SPI, reflow soldering, and pick-and-place machines, enabling rapid network setup.

Wide Application Scenarios

SMT Placement Production Line: Placed after the pick-and-place machine and reflow soldering machine, buffering and storing PCB boards, balancing the production cycle of each process, and solving the problem of board blockage and layer breakage on the production line.

Semiconductor manufacturing process: Used as a temporary buffer between wafers and chips between photolithography, etching, and packaging processes to ensure smooth process transitions.

Back-end inspection station: Equipped with SPI solder paste inspection and AOI optical inspection equipment, it automatically receives inspection signals, separates and collects NG (non-compliant) and OK (compliant) boards, achieving automated sorting and saving on manual sorting costs.