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Oukai OK-SP460-C Auto Stencil Cleaning Fully Automatic Solder Paste Printer Dry Wet Vacuum 510×340mm PCB SMT Equipment

Basic Properties
Place of Origin: Guangdong, China
Brand Name: Okai Intelligent Technology Co., Ltd.
Certification: ISO 9001
Model Number: OK-GBQXJ
Trading Properties
Minimum Order Quantity: 1 Set
Price: open to negotiation
Payment Terms: T/T
Supply Ability: 200 Sets per Month
Product Summary
Fully automatic solder paste printer with integrated dry/wet/vacuum three-mode stencil cleaning system, maintaining aperture cleanliness and print consistency during extended production runs.

Product Details

Highlight:

Auto Stencil Cleaning Printer

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Dry Wet Vacuum Clean SMT

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Automatic Screen Wipe Printer

Printer Model: OK-SP460-C
Cleaning Modes: Dry, Wet, Vacuum 3 Modes
Cleaning Paper: 400mm Roll Width
Cleaning Frequency: Programmable 1-99 Prints
Repeat Accuracy: ±15μm
Printing Accuracy: ±30μm
Max PCB Size: 510×340mm
Min PCB Size: 50×50mm
Cycle Time: Under 10s
Solvent Type: IPA Or Alcohol-based
Power Supply: AC 220V 50/60Hz 2.5KW
Product Description

OK-SP460-C Auto Stencil Cleaning Fully Automatic Solder Paste Printer

The OK-SP460-C is equipped with an integrated three-mode automatic stencil cleaning system (dry, wet, and vacuum) that maintains stencil aperture integrity through extended production runs. By eliminating manual stencil wiping, it reduces downtime, improves print consistency, and extends stencil service life.

Key Features

  • Three-Mode Cleaning: Dry wipe removes residual paste, wet cleaning dissolves hardened deposits, and vacuum extraction removes debris automatically
  • Programmable Frequency: Set cleaning intervals from every 1 to 99 prints based on paste type and production requirements
  • 400mm Paper Roll: Large-capacity cleaning paper roll supports full-shift unmanned operation
  • Bottom-Side Cleaning: Dedicated underside cleaning mechanism prevents paste buildup that causes bridging defects
  • Solvent Management: Precision solvent dispensing with low-level sensor alarm prevents dry-wipe cleaning damage to stencils
  • CCD Vision Alignment: Accurate registration maintained throughout cleaning cycles with automatic recalibration

Technical Specifications

ParameterValue
Cleaning ModesDry, Wet, Vacuum
Cleaning Paper Width400mm roll
Cleaning FrequencyProgrammable, 1-99 prints
Max PCB Size510*340mm
Min PCB Size50*50mm
Repeat Accuracy±15μm
Printing Accuracy±30μm
Cycle Timeunder 10s

Applications

Ideal for 24/7 high-volume SMT lines running fine-pitch paste (Type 4/5) where stencil clogging can cause intermittent printing defects. Recommended for automotive electronics, smartphone assembly, and any process where first-pass yield above 99.5 percent is required.

Packaging and Shipping

Standard export wooden crate packaging with dedicated compartment for cleaning consumables including initial roll. Shipping in 7-15 working days.

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