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Quality SMT solder paste centrifugal mixing and degassing machine factory
Quality SMT solder paste centrifugal mixing and degassing machine factory
Quality SMT solder paste centrifugal mixing and degassing machine factory
Quality SMT solder paste centrifugal mixing and degassing machine factory
Quality SMT solder paste centrifugal mixing and degassing machine factory
Quality SMT solder paste centrifugal mixing and degassing machine factory
Quality SMT solder paste centrifugal mixing and degassing machine factory
Quality SMT solder paste centrifugal mixing and degassing machine factory
Quality SMT solder paste centrifugal mixing and degassing machine factory

SMT solder paste centrifugal mixing and degassing machine

Basic Properties
Place of Origin: Guangdong, China
Brand Name: Okai Intelligent Technology Co., Ltd.
Certification: ISO 9001
Model Number: OK-XGJBJ
Trading Properties
Minimum Order Quantity: 1 Set
Price: open to negotiation
Payment Terms: T/T
Supply Ability: 500 Sets per Month
Tags

SMT Solder Paste Printer

smt printing machine

solder paste printing machine
Product Summary
Solder paste aging inspection and quality control tester for verifying viscosity, slump, tack, and solder ball performance of aged solder paste before production use.

Product Details

Highlight:

Solder Paste Aging Tester

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Viscosity Slump Tack Inspection

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Paste Quality Control Equipment
Machine Model: OK-QC500
Test Functions: Viscosity Slump Tack Solder Ball
Test Standards: IPC-TM-650 JIS Z 3284
Temperature Range: Ambient To 250 Degree C
Display: LCD Digital With Data Export
Sample Size: Standard 500g Jar Compatible
Power Supply: AC 110V/220V 50/60Hz
Dimensions: 350×300×200mm
Product Description

OK-QC500 Solder Paste Aging Inspection Tester

The OK-QC500 is a dedicated solder paste quality control tester for verifying that aged and rewarmed solder paste meets printing specifications before entering production. It performs the four critical IPC-TM-650 standard tests — viscosity, slump, tack, and solder ball — providing lab-grade quality assurance in a compact benchtop instrument.

Key Features

  • Viscosity Test: Measures paste viscosity after rewarming against manufacturer specifications to verify proper flow characteristics for stencil printing
  • Slump Test: Evaluates paste shape retention after printing — cold or over-aged paste that spreads laterally will be detected before causing bridging defects
  • Tack Test: Quantifies paste tackiness to ensure adequate component hold force during placement and transport before reflow
  • Solder Ball Test: Identifies paste degradation by checking for excessive solder ball formation during reflow — a key indicator of expired or improperly stored paste
  • IPC-TM-650 and JIS Z 3284 Compliant: Test protocols aligned with international industry standards for auditable quality records

Applications

Essential for SMT quality labs, incoming inspection departments, and production lines running fine-pitch assembly where paste quality directly impacts first-pass yield. Recommended for facilities using refrigerated paste storage and FIFO inventory management.

Packaging and Shipping

Compact benchtop instrument with standard export packaging. Includes calibrated test fixtures and protocol documentation. Delivery in 3-7 working days.

Mr. Cai

general manager

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