quality High Precision SMT Solder Paste Printer | Touch Screen & PLC Control factory

High Precision SMT Solder Paste Printer | Touch Screen & PLC Control

Name: High Precision SMT Solder Paste Printer | Touch Screen & PLC Control
Brand: Guangdong Okai Intelligent Technology Co., Ltd.
SKU: Okai-SASPP
Availability: InStock

Basic Properties

Place of Origin: Mainland China

Brand Name: Okai Intelligent Technology Co., Ltd.

Certification: ISO 9001

Model Number: Okai-SASPP

Trading Properties

Minimum Order Quantity: MOQ: 1 SET

Price: open to negotiation

Payment Terms: ,T/T

Supply Ability: 1000 Sets / Month

Product Summary

Full automatic / semi-automatic solder paste printing machines for SMT line. High printing accuracy, stable operation, easy adjustment, widely used for PCB solder paste printing.

Product Description

Our SMT Solder Paste Printer is engineered for reliable, high-precision performance in electronics manufacturing.

**Key Features**
- Closed sheet metal and aluminum alloy structure design ensures the highest level of safety protection.
- Intuitive touch-screen control interface with automatic fault diagnosis for convenient human-machine interaction.
- Multiple sound-light alarms and in-screen prompt alerts for real-time operation monitoring.
- PLC control system guarantees stable and reliable operation under continuous production.
- Upper/lower cylinders paired with linear guides ensure perfectly balanced ascending and descending movement.
- Left/right stepper motors, linear guides and frequency converter deliver uniform speed and precise parallelism.
- Fine-tuning knobs for X and Y axes enable accurate alignment adjustment.
- Variable frequency speed control motor ensures smoother and more stable equipment operation.

**Applications**

- In the production of PCBs for consumer electronics (mobile phones, computers, tablets, etc.), it precisely prints solder paste onto PCB pads to prepare for component soldering.
- This semi-automatic printer can also be used for thermal grease printing, accurately applying it between heat-generating components and heat dissipation devices to ensure uniform coating, thus enhancing the heat dissipation efficiency and operational stability of electronic equipment.